Our Technology
We are an engineering research and development team specializing in high-speed mixed signal IO, HBM, DDR3, LPDDR4, LPDDR5, and DDR4 Memory PHY, UCIe PHY and MIPI D-PHY and C-PHY SerDes circuit design, signal and power integrity, high-performance cable, PCB, and packaging design, and 2.5D IC design and packaging. Our goal is to deliver cutting-edge solutions that enhance the performance and reliability of our clients' products.
Our Story
3rd Degree Research was founded by a group of passionate engineers who saw a need for advanced research and development in the technology industry. Our team has extensive experience in high-speed mixed signal IO, HBM, DDR3, LPDDR4, LPDDR5, and DDR4 Memory PHY, UCIe PHY and MIPI D-PHY and C-PHY SerDes circuit design, signal and power integrity, high-performance cable, PCB, and packaging design, and 2.5D IC design and packaging.
We are committed to providing innovative solutions that exceed our clients' expectations. Mutual respect, mindfulness and kindness are key to a productive work environment at 3rd Degree Research. The key to our success with our clients is the expectation that the relationship is based on respect and collaboration and focus on quality of results without sacrificing kindness and mindful and respectful interaction with every individual we connect with on our journey of success.
Our team is composed of experienced engineers and researchers who are dedicated to advancing the technology industry. We have a deep understanding of high-speed mixed signal IO, HBM, DDR3, LPDDR4, LPDDR5, and DDR4 Memory PHY, UCIe PHY and MIPI D-PHY and C-PHY SerDes circuit design, signal and power integrity, high-performance cable, PCB, and packaging design, and 2.5D IC design and packaging. Our leadership has a combined experience of over 100 years in the industry and is committed to delivering exceptional results.
